IBM launches Telum
hitech 2021-08-24 18:44:53
At Hot Chips, today, IBM showed its Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time .
Telum is IBM’s first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place.
Three years in development, this on-chip hardware acceleration is designed to help customers achieve business insights at scale across banking, finance, trading, insurance applications and customer interactions. A Telum-based system is planned for the first half of 2022.
Telum is designed to enable applications to run efficiently where the data resides, helping to overcome traditional enterprise AI approaches that tend to require significant memory and data movement capabilities to handle inferencing.
With Telum, the accelerator in close proximity to mission critical data and applications means that enterprises can conduct high volume inferencing for real time sensitive transactions without invoking off platform AI solutions, which may impact performance.Clients can also build and train AI models off-platform, deploy and infer on a Telum-enabled IBM system for analysis.
Tecum helps user to move their thinking from a fraud detection posture to a fraud preventionposture, evolving from catching many cases of fraud today, to a potentially new era of prevention of fraud, without impacting service level agreements (SLAs), before the transaction is completed.
The chip has a centralized design, which allows clients to leverage the full power of the AI processor for AI-specific workloads, making it suitable for financial services workloads like fraud detection, loan processing, clearing and settlement of trades, anti-money laundering and risk analysis. With these new innovations, clients will be positioned to enhance existing rules-based fraud detection or use machine learning, accelerate credit approval processes, improve customer service and profitability, identify which trades or transactions may fail, and propose solutions to create a more efficient settlement process.
The chip, made on Samsung’s 7nm process, contains 8 processor cores with a deep super-scalar out-of-order instruction pipeline, running with more than 5GHz clock frequency, optimized for the demands of heterogenous enterprise class workloads.
The completely redesigned cache and chip-interconnection infrastructure provides 32MB cache per core, and can scale to 32 Telum chips. The dual-chip module design contains 22 billion transistors and 19 miles of wire on 17 metal layers.